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  ? 2003 microchip technology inc. ds40235b-page 1 PS4160 features ? ps401 tested, fully populated modules for evaluation and production  designed to work with 3 cell and 4 cell series li ion configurations  performs all major li ion battery management functions including - accurate capacity monitoring - direct control of external charge circuitry  direct control of secondary safety functions  soc display with four leds and a switch can be removed to use gpios for other operations  fully compliant with industry standard smart battery data specification v1.1a - smbus v1.1 with pec/crc-8 communication with system host  high accuracy measurement of charge/discharge current, voltage, and temperature with on-chip 15-bit integrating a/d  precise capacity reporting using microchip patented algorithms and 3d battery cell models  3d models and ?learned? parameters stored in integrated eprom and eeprom  extremely low power operation: - sleep mode: < 25 a typical - run mode: < 500 a typical - sample mode: < 250 a typical  complete hardware and software development tools available  overall mechanical dimensions: - 0.525 w x 2.500 l (inches) - 13.34 w x 63.50 l (millimeters) board photo ordering information part no. description function PS4160-3 li ion - 3 series cells PS4160-4 li ion - 4 series cells ps401 battery manager module with led soc display
PS4160 ds40235b-page 2 ? 2003 microchip technology inc. 1.0 general description the PS4160 module is a complete smart battery controller subsystem with safety based on the microchip ps401 battery manager with patented accuron? technology. the module is designed to operate in a battery pack consisting of three (3) or four (4) series connected lithium cells. the module consists of three circuit sections ? the microchip ps401 battery manager ic, mitsumi mm1414 based primary safety circuit and a secondary safety circuit controlled by the ps401 to provide backup to the mm1414. 1.1 quick start ? pack assembly follow these directions to assemble a pack with the PS4160 module.  use standard precautions when handling static sensitive devices.  modules should be connected to battery cells in the order indicated below to insure proper start-up and operation. wires should be attached to the modules first and then connected to the battery cells as instructed.  the connection sequence is critical to successful use of the ps401 family of cmos asics. pack positive should always be connected first, followed by the intermediate cell voltages from highest to lowest, and finishing with the negative end of the pack. step 1: configure the module for the number of series cells according to the following chart: step 2: configure the module for the following options. use optional external thermistor the ps401 ic has an integrated temperature sensor. if you would like to add an optional external thermistor, remove r16. charge fet control the PS4160 is shipped with the mitsumi 1414 ic controlling both the charge and discharge fets. if you would like to enable ps401 control of the charge fet, remove r25 and change the value of bit 2 of the flags1 parameter to ?0?. setting bit 2 of flags1 disables the gpios. gpio<3:0> operation: the PS4160 is shipped with four leds for a soc display. these leds are connected to gpio<3:0> pins on the ps401 ic. the gpio<3:0> pins can be used for operation other than the led soc display by removing the led and monitoring the adjacent test point. step 3: connect wires to module. use large diameter wire (18awg-20 awg) for current carrying lines from vr and v1. all others are signal only lines (24 to 22 awg). step 4: connect v1 to the most positive point on the battery cell stack. step 5: connect cell voltage pickups: 4 series cells ? negative end of topmost cell in stack to v2, negative end of next cell to v3, and negative end of third cell to v4. 3 series cells ? negative end of topmost cell in stack to v2, negative end of next cell to v3, no connection at v4. step 6: connect vr to the most negative point on the battery cell stack. step 7: connect external connector to b-neg, t, c, d and b+. step 8: the PS4160 is shipped with the secondary safety circuit disabled to avoid damage to the fuse during assembly. to enable the secondary safety circuit, remove r23 and change the value of bit 2 of the flags1 parameter to ?0?. setting bit 2 of flags1 disables the gpios configured for safety. step 9: program the assembled pack using microchip's powertool? software and powercal? board or powerinfo? board hardware. the eeprom parameters can be changed at will using the utilities on the p4 ee page in the powertool software. the otp eprom parameters can be changed a limited number of times using utilities on the p4 otp page. to write to the otp eprom, an additional voltage (v pp ) must be applied to the ps401. this programming voltage can be obtained from the powerinfo board and applied to the PS4160 at connection vp (small thru-hole) located on the small edge of the board opposite the connector edge. step 10: calibrate the pack using the powertool software and powercal board hardware. the pack is now ready for use. li ion 3-cell li ion 4-cell r27 removed installed r28 installed removed r30 installed removed
? 2003 microchip technology inc. ds40235b-page 3 PS4160 figure 1-1: board assembly (side 1)  connection points for cells and connector are located here.  to add an external thermistor, remove r16 (left side of drawing above).  to enable the secondary safety circuit, remove r23 (to the right of ps401, label at top). figure 1-2: board assembly (side 2)  follow chart in step one to configure module for 3 or 4 series cells. the configuration resistors are located on side 2. follow the label line to locate the resistors. approximate label locations follow. - r27 - top of drawing, above protection ic, u2. - r28 - bottom of drawing, below protection ic, u2. - r30 - bottom of drawing, right of r28, left of r22.  to enable ps401 control of the charge fet, remove r25 (right side of drawing, label at top).  leds and the test points for the gpios are located here.
PS4160 ds40235b-page 4 ? 2003 microchip technology inc. 2.0 functional description 2.1 ps401 fuel gauge the module fuel gauge provides state-of-charge (soc) and battery status data in accordance with the smbus standards version 1.1. the ps401 monitors the cell voltages, battery temperature, and current to deter- mine soc and battery status. the state-of-charge calculations are compensated for cell self discharge. the remaining time calculation is compensated for temperature and discharge rate. the parameters for determining battery status flags and alarm thresholds are all programmable as is the battery design capacity and the battery performance model data. please refer to the ps401 single chip battery manager data sheet (ds40238) for details on configuring the ps401. 2.2 primary safety the primary safety circuit provides cell protection from conditions of overcharge, overdischarge and over- current. analog ic mm1414dv from mitsumi measures individual cell voltages and voltage across the discharge fet. these values are compared against internal reference values and the gates of two p-channel power mosfets are controlled based on the comparison results. 2.3 secondary safety a secondary level of safety protection is provided on the PS4160. gpio<6> (pin 4) of the ps401, with r25 removed and bit 2 of flags1 = 0, is programmed to provide backup overcharge protection and is activated in the case of pack over voltage, over temperature or charge over current. in the situation where the param- eter being monitored is the same as that of the mm1414 the limits are set beyond those of the mm1414. this means that the secondary protection is triggered only in the event the primary protection fails to activate. 2.4 ultimate safety the third level of safety protection is activated by gpio<7> (pin 5) of the ps401 when r23 is removed and bit 2 of flags1 = 0. this pin is activated whenever any individual cell voltage is measured above a pro- grammable limit that is beyond both the primary and secondary safety limits. an n-channel mosfet is turned on and allows current to pass through the resis- tive heater section of a fuse. this heating opens the fuse, permanently disabling the pack from further charge or discharge. 2.5 otp eprom programming to write to the otp eprom, an additional voltage (v pp ) must be applied to the ps401. this programming voltage can be obtained from the powerinfo board and applied to the PS4160 at connection vp (small thru- hole) located on the small edge of the board opposite the connector edge. then use the utilities located on the ps otp page of the powertool software to write new values to the ps401 otp eprom. 2.6 programmable i/os the PS4160 features four additional pins, gpio<3:0> (pins 24-27), which are used to drive the led soc display. gpio<5> (pin 3), is connected to the switch which activates the led display. alternately, these gpios may be used for other purposes by removing the unused leds, programming the pins appropriately, and using the adjacent test points to monitor the pins. 3.0 board description pcb schematics and bill of materials are included here for completeness. to download full size schematic and bom, please visit the microchip web site (www.microchip.com).
? 2003 microchip technology inc. ds40235b-page 5 PS4160 figure 3-1: board schematic 1 2 3 4 56 a b c d 6 5 4 3 2 1 d c b a 1 microchip technology, inc. powersmart products group 2745 dallas parkway, suite 400 plano, tx 75093 469-241-0087 voice/469-241-0106 fax 1 PS4160 schematic 826127-01-03 b 13-sep-2002 17:53:52 826127-01-03b.sch sheet of *** confidential *** this document contains proprietary information that is the intellectual property of microchip technology, inc. size drawing no. code ident no. rev b file scale none title approvals date contract no. http://www.microchip.com drawn checked c2 100nf c3 100nf c4 100nf c17 100nf d3 smbj20a c6 100nf q3 nds355n c19 47pf r35 365 ov 1 cs 3 dchg 5 cdc 7 col 8 cov 9 gnd 10 sel 11 con 13 v1 15 v2 16 v3 17 v4 18 vcc 20 nc 2 nc 4 nc 6 nc 12 nc 14 nc 19 u2 mm1414dv c14 100nf c13 100nf c12 100nf c11 100nf r11 220 r12 220 r13 220 r14 220 r15 330 c15 100nf r27 open r28 0 c10 2.2nf c9 10nf c8 100nf r31 100 r41 2.0m r37 200k r38 200k q4 mmbt3904 r39 430k r40 20k q6 mmbt3906 cell connection pack connections current sense resistor external thermistor connections (semitec 103at or 103etb -- 10k at 25c) primary safety circuit sec. safety output vddd 1 gpio(4) 2 gpio(5) 3 gpio(6) 4 gpio(7) 5 scl 6 sda 7 vc(4) 8 vc(3) 9 vc(2) 10 vc(1) 11 vdda 12 vssa 13 rshp 14 rshn 15 vntc 16 vreft 17 rosc 18 xtal1 19 xtal2 20 tstclk 21 vpp 22 ntest 23 gpio(0) 24 gpio(1) 25 gpio(2) 26 gpio(3) 27 vssd 28 u1 ps401 r33 5.1k r34 1.5k vp v1 v2 v3 v4 vr r26 221k tr tn c1 330nf d c t b+ b- q1 is discharge control switch q2 is charge control switch c16 100nf r32 15 r30 0 caution! remove r30 for 4-cell a pplications! 3 1 4 f1 sfd167a q5 5hp01m 3 1 2 d1 az23c5v6 3 1 2 d2 az23c5v6 vr b+ b- c d t v4 v3 v2 v1 tn tr vp c7 330nf c5 330nf r36 0.020 r2 220 r3 220 r4 220 r24 200k led0 led1 led2 led3 c18 1.0nf r23 0 r25 0 r1 3.65k r29 5.1k r7 150 r8 150 r5 150 r6 150 r16 0 configuration table -- zero-ohm jumpers configuration dat a in eeprom must also be set to reflect the features selected by these jumper settings. r16 -- remove only when external thermistor is used. r23 -- remove to enable secondary safety. r25 -- remove to enable ps401 control of charge control switch. board is shipped with r27/r28/r30 configured for 3-cell operation, as shown on schematic. make the following changes for 4-cell operation. r27 -- left open during manufacture; place jumper from r28 here for 4-cell operation. r28 -- remove this jumper, and move it to the r27 location for 4-cell operation. r30 -- remove for 4-cell operation. r21 and r22 are used to enable pack-powered programming of otp, which is normally disabled. contact an applications engineer for guidance before implementing this feature. r9 360 r10 360 q8 5hp01m r21 open r22 open q7 2n7002 c20 open 5 4 1 2 3 6 7 8 q2 tpc8108 5 4 1 2 3 6 7 8 q1 tpc8108 sw1 skqgade010 tp1 tp2 tp3 tp4 tp5 tp6 r. casebolt 9/13/2002
PS4160 ds40235b-page 6 ? 2003 microchip technology inc. table 3-1: bill of materials symbols description manufacturer manufacturer part number qty c9 capacitor, ceramic, 10 nf, 25v, +/- 10%, x7r dielectric, 0603 panasonic ecj-1vb1e103k 1 c18, c20 capacitor, ceramic, 1.0 nf, 50v, +/- 10%, x7r dielectric, 0603 panasonic ecj-1vb1h102k 2 c10 capacitor, ceramic, 2.2 nf, 50v, +/-10% , x7r dielectric, 0603 panasonic ecj-1vb1h222k 1 c19 capacitor, ceramic, 47 pf, 50v, +/-5%, c0g dielectric, 0603 panasonic ecj-1vc1h470j 1 c2-c4, c6 c11-c17 capacitor, ceramic, 100 nf, 25v, +80%/-20%, y5v dielectric, 0603 panasonic ecj-1vf1e104z 11 c8 capacitor, ceramic, 100 nf, 25v, +/-10%, x7r dielectric, 0805 panasonic ecj-2vb1e104k 1 c5, c7 capacitor, ceramic, 330 nf, 25v, +80%/-20%, y5v dielectric, 0805 panasonic ecj-2yf1e334z 2 c1 capacitor, ceramic, 330 nf, 25v, +/-10%, x7r dielectric, 1206 panasonic ecj-3vb1e334k 1 led0- led3 led, clear green, 1206 package lumex sml-lx1206gc-tr 4 d3 tvs, 20v, 600w, unipolar, smb package diodes, inc. crydom smbj20a-13 smbj20a 1 d1, d2 dual zener diode, 5.6v +/- 5%, 300 mw, common-anode, sot-23 diodes inc. general semiconductor az23c5v6-7 az23-c5v6 2 f1 fuse, battery-pack protector, 7a, 36 v dc , 50a breaking capacity, 5 +/- 1.5 mohm resistance, 31.6 +/- 3.2 ohms heater resistance, 11.1-25.0v heater operating volt age range, ul248-14, 3-terminal surface-mount package sony chemicals sfd-167a 1 raw pcb, PS4160 microchip technology inc. pcb-826127-01-03 1 q4 transistor, npn, 40v, 350 mw sot-23 diodes inc. mmbt3904-7 1 q6 transistor, pnp, -40v, 350 mw sot-23 diodes inc. mmbt3906-7 1 q5, q8 mosfet, p-channel enhancement-mode, -50v, 250 mw, surface- mount package sanyo 5hp01m 2 q1, q2 mosfet, p-channel enhancement-mode, -30v, -11a, 9.5 mohm, 1.9w, so-8 toshiba tpc8108 2 q7 mosfet, n-channel enhancement-mode, 60v, 115 ma, 7.5 ohm, 200 mw, sot-23 fairchild semiconductor 2n7002 1 q3 mosfet, n-channel enhancement-mode, 30v, 1.6a, 0.125 ohm, 500 mw, sot-23 fairchild semiconductor nds355n 1 r26 resistor, film, 0603, 1%, 221 kohms panasonic erj-3ekf2213v 1 r1 resistor, film, 0603, 1%, 3.65 kohms panasonic erj-3ekf3651v 1 r35 resistor, film, 0603, 1%, 365 ohms panasonic erj-3ekf3650v 1 r16, r21, r23, r25, r28, r30 resistor, zero-ohm, 0603 panasonic erj-3gey0r00v 6 r34 resistor, film, 0603, 5%, 1.5 kohms panasonic erj-3geyj152v 1 r31 resistor, film, 0603, 5%, 100 ohms panasonic erj-3geyj101v 1 r5-r8 resistor, film, 0603, 5%, 150 ohms panasonic erj-3geyj151v 4 r32 resistor, film, 0603, 5%, 15 ohms panasonic erj-3geyj150v 1 r41 resistor, film, 0603, 5%, 2.0 megohms panasonic erj-3geyj205v 1 r24, r37-r38 resistor, film, 0603, 5%, 200 kohms panasonic erj-3geyj204v 3 r40 resistor, film, 0603, 5%, 20 kohms panasonic erj-3geyj203v 1 r2-r4, r11-r14 resistor, film, 0603, 5%, 220 ohms panasonic erj-3geyj221v 7 r15 resistor, film, 0603, 5%, 330 ohms panasonic erj-3geyj331v 1 r39 resistor, film, 0603, 5%, 430 kohms panasonic erj-3geyj434v 1 r29, r33 resistor, film, 0603, 5%, 5.1 kohms panasonic erj-3geyj512v 2 r9-r10 resistor, film, 0805, 5%, 360 ohms panasonic erj-6geyj361v 2 r36 resistor, metal strip, 2512, 1%, 0.020 ohms vishay wsl2512-0.020- 1%-r86 1 sw1 switch, spst-momentary, push button, surface-mount alps skqgade010 1 u1 ic, single-chip battery manager, programmable, -25 c to 85 c, ssop-28 microchip technology inc. ps401 1 u2 ic, battery protection circuit, li-ion, 3- or 4-cell, -20 c to 70 c, tsop-20 mitsumi mm1414dv 1
? 2003 microchip technology inc. ds40235b-page 7 PS4160 3.1 mechanical dimensions overall dimensions: 2500 mils x 525 mils figure 3-2: ps401 battery manager module with led soc display
PS4160 ds40235b-page 8 ? 2003 microchip technology inc. 4.0 development tool summary microchip provides all the necessary hardware and software to enable easy tailoring of battery control algorithm parameters and cell performance models to meet specific application requirements and attain the highest accuracy available anywhere. table 4-1 summarizes the development tool offering from microchip to support the PS4160. please refer to the microchip web site for ordering information and design documentation (including schematics) at www.microchip.com. 4.1 reference documents this data sheet provides an overview of the PS4160 battery manager module. for further information on the ps401 and development tool operations, please refer to the documents listed in table 4-2 available for download at www.microchip.com. table 4-1: microchip development tool summary table 4-2: microchip reference documents development tool use powerinfo? hardware with powertool? software (ps041) read and write smart battery data values, eeprom programming, otp eprom programming powercal? hardware with powertool software (ps042) read and write smart battery data values, eeprom programming, otp eprom programming, pack calibration, pack test document number documents available ds40238a ps401 single chip battery manager data sheet (ic products) ds40234a ps041 powerinfo configuration interface product brief ds40237a ps042 powercal calibration platform data sheet
? 2003 microchip technology inc. ds40235b-page 9 PS4160 information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. it is your responsibility to ensure that your application m eets with your specifications. no representation or warranty is given and no liability is assumed by microchip technol ogy incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. use of microc hip?s products as critical com- ponents in life support systems is not authorized except with express written approval by mi crochip. no licenses are con- veyed, implicitly or otherwis e, under any intellectual property rights. trademarks the microchip name and logo, the microchip logo and powersmart are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. accuron, powercal, powerinfo, powermate, powertool, smartsensor, smartshunt and smarttel are trademarks of microchip technology incorporated in the u.s.a. and other countries. all other trademarks mentioned he rein are property of their respective companies. ? 2003, microchip technology incorporated. printed in the u.s.a., all rights reserved. printed on recycled paper.
ds40235b-page 10 ? 2003 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: 480-792-7627 web address: http://www.microchip.com atlanta 3780 mansell road, suite 130 alpharetta, ga 30022 tel: 770-640-0034 fax: 770-640-0307 boston 2 lan drive, suite 120 westford, ma 01886 tel: 978-692-3848 fax: 978-692-3821 chicago 333 pierce road, suite 180 itasca, il 60143 tel: 630-285-0071 fax: 630-285-0075 dallas 4570 westgrove drive, suite 160 addison, tx 75001 tel: 972-818-7423 fax: 972-818-2924 detroit tri-atria office building 32255 northwestern highway, suite 190 farmington hills, mi 48334 tel: 248-538-2250 fax: 248-538-2260 kokomo 2767 s. albright road kokomo, indiana 46902 tel: 765-864-8360 fax: 765-864-8387 los angeles 18201 von karman, suite 1090 irvine, ca 92612 tel: 949-263-1888 fax: 949-263-1338 phoenix 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7966 fax: 480-792-4338 san jose microchip technology inc. 2107 north first street, suite 590 san jose, ca 95131 tel: 408-436-7950 fax: 408-436-7955 toronto 6285 northam drive, suite 108 mississauga, ontario l4v 1x5, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific australia microchip technology australia pty ltd marketing support division suite 22, 41 rawson street epping 2121, nsw australia tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing microchip technology consulting (shanghai) co., ltd., beijing liaison office unit 915 bei hai wan tai bldg. no. 6 chaoyangmen beidajie beijing, 100027, no. china tel: 86-10-85282100 fax: 86-10-85282104 china - chengdu microchip technology consulting (shanghai) co., ltd., chengdu liaison office rm. 2401-2402, 24th floor, ming xing financial tower no. 88 tidu street chengdu 610016, china tel: 86-28-86766200 fax: 86-28-86766599 china - fuzhou microchip technology consulting (shanghai) co., ltd., fuzhou liaison office unit 28f, world trade plaza no. 71 wusi road fuzhou 350001, china tel: 86-591-7503506 fax: 86-591-7503521 china - hong kong sar microchip technology hongkong ltd. unit 901-6, tower 2, metroplaza 223 hing fong road kwai fong, n.t., hong kong tel: 852-2401-1200 fax: 852-2401-3431 china - shanghai microchip technology consulting (shanghai) co., ltd. room 701, bldg. b far east international plaza no. 317 xian xia road shanghai, 200051 tel: 86-21-6275-5700 fax: 86-21-6275-5060 china - shenzhen microchip technology consulting (shanghai) co., ltd., shenzhen liaison office rm. 1812, 18/f, building a, united plaza no. 5022 binhe road, futian district shenzhen 518033, china tel: 86-755-82901380 fax: 86-755-82966626 china - qingdao rm. b505a, fullhope plaza, no. 12 hong kong central rd. qingdao 266071, china tel: 86-532-5027355 fax: 86-532-5027205 india microchip technology inc. india liaison office marketing support division divyasree chambers 1 floor, wing a (a3/a4) no. 11, o?shaugnessey road bangalore, 560 025, india tel: 91-80-2290061 fax: 91-80-2290062 japan microchip technology japan k.k. benex s-1 6f 3-18-20, shinyokohama kohoku-ku, yokohama-shi kanagawa, 222-0033, japan tel: 81-45-471- 6166 fax: 81-45-471-6122 korea microchip technology korea 168-1, youngbo bldg. 3 floor samsung-dong, kangnam-ku seoul, korea 135-882 tel: 82-2-554-7200 fax: 82-2-558-5934 singapore microchip technology singapore pte ltd. 200 middle road #07-02 prime centre singapore, 188980 tel: 65-6334-8870 fax: 65-6334-8850 taiwan microchip technology (barbados) inc., taiwan branch 11f-3, no. 207 tung hua north road taipei, 105, taiwan tel: 886-2-2717-7175 fax: 886-2-2545-0139 europe austria microchip technology austria gmbh durisolstrasse 2 a-4600 wels austria tel: 43-7242-2244-399 fax: 43-7242-2244-393 denmark microchip technology nordic aps regus business centre lautrup hoj 1-3 ballerup dk-2750 denmark tel: 45 4420 9895 fax: 45 4420 9910 france microchip technology sarl parc d?activite du moulin de massy 43 rue du saule trapu batiment a - ler etage 91300 massy, france tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany microchip technology gmbh steinheilstrasse 10 d-85737 ismaning, germany tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy microchip technology srl via quasimodo, 12 20025 legnano (mi) milan, italy tel: 39-0331-742611 fax: 39-0331-466781 united kingdom microchip ltd. 505 eskdale road winnersh triangle wokingham berkshire, england rg41 5tu tel: 44 118 921 5869 fax: 44-118 921-5820 03/25/03 w orldwide s ales and s ervice


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